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Semiconductor packaging aging verification test-PCT high voltage accelerated aging test chamber

Application:

PCT high pressure accelerated aging test chamber is a kind of test equipment that uses heating to generate steam. In a closed steamer, the steam cannot overflow, and the pressure continues to rise, which makes the boiling point of water continue to increase, and the temperature in the pot also increases accordingly.

Generally used to test the high humidity resistance of products and materials under harsh temperature, saturated humidity (100%RH) [saturated water vapor] and pressure environment.
For example: testing the moisture absorption rate of printed circuit boards (PCB or FPC), the moisture resistance of semiconductor packages, the circuit break caused by corrosion of metallized areas, and the short circuit caused by contamination between package pins.

 

Test reference conditions:

1. Meet the temperature range of +105℃~+162.5℃, humidity range of 100%R.H
2. The industry's first application of fluid simulation design technology and product process manufacturing technology, the product is more energy-efficient.
3. The inner tank adopts a double-layer arc design to prevent condensation and dripping during the test, thereby avoiding the product being directly impacted by superheated steam during the test and affecting the test results.
4. Fully automatic water replenishment function, front water level confirmation.

 

Equipment performance:

1. In the customized SSD-specific PCT high-voltage accelerated aging test chamber, aging test, constant temperature test or high and low temperature cross test can be carried out simultaneously;
2. The test temperature standard can reach the industrial level, with the highest temperature reaching 150℃ and the lowest reaching minus 60℃, and the temperature adjustment program is automated;
3. During the temperature change process, water vapor will also be formed, which can create harsh test environment conditions.

 

Powerful effects:

1. The tested product is placed under severe temperature, humidity and pressure, which will accelerate the aging life test and shorten the product life test time overall;
2. It can detect the sealing and pressure resistance of the packaging of the product's electronic components, so as to judge the environmental adaptability and working pressure adaptability of the product!
3. The customized inner box structure ensures that the temperature, humidity and pressure of the product are balanced during the test!

The most important thing is that the entire equipment circuit is integrated and designed, which is simple to operate and easy to maintain.
Many solid-state product manufacturers attach great importance to testing and are also very troubled by it. On the one hand, it is because the testing time is long, and on the other hand, the testing work is the guarantee of product yield and rework rate. At this time, an efficient and reliable testing equipment is particularly important!
We have advanced production and testing equipment and a professional technical team; we can design, develop and produce according to customer requirements, and continuously test and improve product quality. With the company's leading technology, exquisite craftsmanship, standardized production, strict management, perfect service, and innovative technology, we have won the praise and trust of many customers and have achieved leading development in the industry.

5.Semiconductor packaging aging verification test-

Post time: Aug-26-2024